RAM stands for Random Access Memory used by the computer as a temporary workplace. Processor to move data and applications from being processed as a permanent repository or optical disk into the RAM of storage devise. Processors akanmenjalankan existing applications and data from this temporary storage. Any new data that will be created and stored temporarily in memory before being stored permanently on your hard disk. Each byteinformasi used by the computer during a memory operation will go through during the journey either from or to the 1 / 0 devices, proseseor or hard disk.VS DDR2 DDR
Present as a complement to his true DDR2 chipsets feature the latest keluaranIntel. DDR 2 (DDR read both genres) than its predecessor runs with a lower voltage to reduce heat and increase the capacity of chips to boost capacity memory module. Also DDR 2 is also designed with a larger size 240 pins compared with only 184 pin DDR. This is affecting the size of existing socket in center penyanggayang memory.
DDR 2 can only work optimally if the motherboard is used capable of accommodating clock speed. For example, the memory will perform optimally in 1066 while working on the mobo with the same FSB, but not so with DDR 533 on the same mobo. In theorists, DDR 2 is actually more compatible than DDR.DDR 3, Future Memory
So far the standard DDR 3 is still in talks serius.Meski Thus, 3 DDR memory technology - like the series DDR 2 - telahmatang and well established platform used on DDR 3 memory VGA.Teknologi diVGA by many been considered the top tertinggisehingga must be immediately implemented into the module DDR.seperti cases of peripheral technologies that others, not the standard default is true in other words not yet ready to receive new product market. DDR 3 was issued to address the issue of frequency limitations as a result of the weakness of the termination system and command-line determination of addresses on the chip DDR 2.Ini compounded by issues of heat and electricity consumption is considered quite high. DDR 3 is expected later will only consume a maximum power of 0.8 volts or 1 volt lower than the current DDR 2 ini.Dengan the low voltage used, the heat can be muted diharapkantingkat optimal as possible so that the memory frequency can be increased higher lagi.Diharapkan DDR 3 will be capable of running at a bus speed of 1333 and 1600. DDR 3 is mentioned will have an independent memory controller. As such, this memory is able to work independently with performamaksimaal when mendisrtibusikan data or applications without having to depend on the length of the path or level of complexity or to the south or to the prosesor.Dalam brodge terms of size seems DDR 3 will also appear larger than the size of a pin DDR 2.Diperkirakan used will range from 296 to 312 pin.Teknologi most look forward to from DDR 3 is QBM (Quad BandMemory, a memory technology which is equivalent denganteknologi VIA.teknologi released 4-channel). QBM own unfortunately very dependent padaperkembangan progress in dealing with the process of processor specifications or to memori.Meski datadari his future is uncertain, DDR 3 at least seven years would appear palinglambat mendatang.Perkembangan untukmemperbaharui processor and the demands of market structure can be certain to be forced banyakkalangan memory switch to new technologies this.
No comments:
Post a Comment